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Event Description
The 10th edition of AMI’s Thin Wall Packaging event takes place at the Intercontinental Chicago Magnificent Mile Hotel in Chicago, IL, USA on June 20-21, 2023.
The two-day event reflects the current, overriding drive towards more sustainable food packaging. It will incorporate the latest developments in thin wall molded fiber in parallel to plastics and will explore how to maximize innovation, sustainability, and circularity in the lightweight tubs, pots, and trays sector.
Organizers
Applied Market Information LLC
How to Register?
Visit https://www.ami-events.com/event/51556869-45b0-44e0-be8a-ee14a9009cfd/regProcessStep1?RefId=Related_Product_TWP_NA to register for the event.
Exhibitor Profile
The agenda covers both the functionality and sustainability of plastic and fiber-based materials in protecting and preserving items such as meat, fish, yogurt, fruit and vegetables, dairy, and ready meals. It discusses the very latest innovations, applications, technology developments, improved decoration, and automation for leading food companies, retailers, packaging manufacturers, researchers, and suppliers of the industry.
Visitor Profile
Discuss the latest material, technical and machinery innovations
Keep up to date on the latest trends in global thin wall packaging markets
Learn about sustainability goals and regulations effecting the thin wall packaging supply chain
Understand developments in recycling technology that affect the thin-wall packaging industry
Network, in person, with industry experts and build professional contacts
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